Description
Features and Benefits
• 5.0W/m-K thermal conductivity
• Good compressibility
• Naturally tacky
• Electrically isolating
• RoHS compliant
Typical Applications
• Cooling component to the chassis,
frame, or other type of heat spreader
• Mass storage devise
• Heat pipe assemblies
• RDRAM memory modules
• Motor control
• Telecommunication hardware
Optional Configurations
• Can be die-cut into specific dimensions