Description
Features and Benefits
- 2.0W/m-K thermal conductivity
- Good compressibility
- Non-silicone gap pad
- RoHS compliant
- Halogen-free
Typical Applications
- Cooling component to the chassis, frame, or other type of heat spreader
- Mass storage devise
- Heat pipe assemblies
- RDRAM memory modules
- Motor control
- Telecommunication hardware
- Optional Configurations
Optional Configurations
- Can be die-cut into specific dimensions