Todays computer and telecommunications circuit cards demand increased EMI performance. The post-treated, post-plated beryllium copper (BeCu) gaskets exhibit improved performance and withstand thousands in insertion cycles without degradation.

The new 7-19PCI gasket was developed to improve the EMI seal between Coampact PCI circuit card faceplates. This is accomplished by using a series of individual finger contacts rather than a continuous strip contact that had poor flexibility and suffered deformation over time. This improved design also reduced the force load build-up and allowed for easy card insertion in racks of 20+ circuit cards.

The new PCI-VME serices offers these design features:

• A series of individual fingers to achieve maximum conformal contact.
• A single radius dome top profile to ease card loading and eliminate high stress in the contact area of the spring.
• The industry standard manufacturing process for BeCu fingerstock gaskets (post heat-treated and post-plated alloy 25).
  
  Schlegel offers two BeCu gasket sizes for extrusion variations and, for cost driven applications, both sizes are offered in stainless steel.

Mounting Options : Extrusion

For specific part numbers and sizes download the BeCu pdf Catalog

Technical Overview